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SYS-CON UK Authors: Salvatore Genovese, Jamie Matusow

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Research and Markets: Reverse Costing Report on the Micro-Bolometer ISC0601B, 320x240 Pixels Supplied by FLIR

Research and Markets (http://www.researchandmarkets.com/research/stgvbd/flir_isc0601b) has announced the addition of the "Flir ISC0601B Micro-bolometer Teardown & Reverse Costing Analysis" report to their offering.

System Plus Consulting is proud to publish a reverse costing report on the micro-bolometer ISC0601B, 320x240 pixels supplied by FLIR.

Flir micro-bolometer technology is based on a vanadium oxide material, with micro-machined structures. Each pixel contains active membranes suspended at 2µm above the readout circuit.

This micro-bolometer is suitable for various applications including thermography, industrial inspection, Building & Renewable Energy, Border Security and coastal surveillance, automotive, etc.

This report provides complete teardown of the Flir ISC0601B sensor with:

- Detailed photos

- Material analysis

- Manufacturing Process Flow

- In-depth economical analysis

- Manufacturing cost breakdown

Selling price estimation The micro-bolometer is part of the FLIR i7 thermal imaging camera. A reverse costing report on the i7 camera is available separately.

Key Topics Covered:

Table of Contents

Glossary

1. Overview/ Introduction

- Glossary

- Executive Summary

- Reverse Costing Methodology

2. Company Profile

- ULIS Profile

- On Semiconductor

3. Physical Analysis

- Synthesis of the Physical Analysis

- IR CameraI7

- Package

- Package x-ray

- Package Front Side

- Package rear side

- Pread Out IC

- ROIC Functions

- ROIC Technology

- Micro Bolometer

- Reflector

- Structure of Pixel

- Micro bridge

- Contact Structure

- Compensation Pixels

- Principle Operation

- Physical Data Summary

4. Manufacturing Process Flow

- Global Overview

- ROIC Process Flow

- Description of the ROIC Water Fabrication Unit

- Description of the Micro-balomerter Process Flow

- Description of the Micro-balomerter Water fabrication Unit

- Packaging

5. Cost Analysis

- Main Steps of Economic Analysis

- Yields Explanation

- Die per wafer & probe test

- ROIC Wafer Front-End cost

6. 200mm Micro-Bolometer Cost Analysis

- Micro Bolometer Wafer Cost

- Micro Bolometer Step Cost

- Micro Bolometer Equipment Cost

- Micro Bolometer Consumable Cost

- Back-End 1: Packaging, Final test

- Component Cost ( FE+BE 0 + BE 1)

- Yields Synthesis

7. Micro Bolometer Price Estimation

- Manufacturer Financial Ratios

- Estimated manufacturer Price

- Synthesis of the cost Analysis

8. Conculsion

For more information visit http://www.researchandmarkets.com/research/stgvbd/flir_isc0601b

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